Components

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Next generation satellite components get smaller and lighter

Next generation satellite components get smaller and lighter
As satellite communications (Satcoms) moves ever upwards in terms of frequency, so systems tend to move down the scale when it comes to weight and size. Whilst Naval platforms, such as ships, retain their overall size, reducing the above the water mass leads to increased stability. Whilst airborne platform have always sought the lightest components, in-vehicle and man-pack communications systems are the latest users of lightweight components, writes Howard Venning, Managing Director of Aspen Electronics.  
31st January 2017

Shock sensor captures the full pulse in high-impact environments

Shock sensor captures the full pulse in high-impact environments
  In this white paper Robert Sill, Senior Scientist, PCB Piezotronics discusses a new micro electromechanical system sensor that has been introduced to capture the full pulse in high-impact environments.
31st January 2017

How to define the best solution for your cabling needs

How to define the best solution for your cabling needs
This white paper presents the technical basics behind sensing over fibre technologies, its main applications and the cabling solutions involved. Jacques Miéville, Project Manager, Fischer Connectors, discusses the key factors that will help you define the best solution for your cabling needs, in order to have the most reliable and easy-to-maintain system that reduces your maintenance operations.
31st January 2017


Hundreds of space grade FPGAs deployed in satellite launch

Hundreds of space grade FPGAs deployed in satellite launch
Hundreds of Xilinx's Space Grade FPGAs were deployed in the launch of the Iridium NEXT satellites. Space Grade Virtex-5QV devices provide scalability and flexibility for new applications and innovations throughout its operational life in space. Iridium NEXT is the company’s next-gen satellite constellation, replacing and enhancing its existing network of low-Earth orbit satellites spanning the entire globe.
30th January 2017

Solid state microwave power models on show at IDEX 2017

Solid state microwave power models on show at IDEX 2017
West London based manufacturer in the microwave and RF field, TMD Technologies (TMD), will be exhibiting for the first time at the International Defence Exhibition and Conference 2017 (IDEX). It will be showing a representative selection of its latest advanced products for air, land and sea defence applications.
26th January 2017

Radiation hardened MOSFETs for space applications

Radiation hardened MOSFETs for space applications
HiRel, an Infineon Technologies company, has launched its first radiation hardened MOSFETs based on the proprietary N-channel R9 technology platform. Compared to previous technologies, the company claims that it is offering size, weight and power improvements. This is significant in systems such as high-throughput satellites, where the cost-per-bit-ratio can be significantly reduced. 
26th January 2017

Resistant epoxy meets NASA outgassing standards

Resistant epoxy meets NASA outgassing standards
Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, optoelectronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications.
13th December 2016

Partnership provides rugged and high temperature IPMs

Partnership provides rugged and high temperature IPMs
A partnership between BETA Transformer Technology Corporation (BETA) and CISSOID has developed compact and reliable Intelligent Power Modules (IPM). These modules are optimised for power converters and motor control within extreme environments, including aerospace, industrial, ground vehicles, automotive, and oil and gas.
21st November 2016

Aircraft sandwich panel allows dispensing on the fly

Aircraft sandwich panel allows dispensing on the fly
A two-component adhesive for aircraft interiors has been developed by DELO Industrial Adhesives. DELO-DUOPOX AB8390 is particularly suited for bonding of light-weight sandwich panels. Before adhesives can be used in aircraft interiors, they are subjected to various tests to prove their suitability. 
7th November 2016

Obsolescence management is flying high

Obsolescence management is flying high
Military and commercial aerospace manufacturers face the problem of electronic component obsolescence. In the past, military equipment used to be in production for several decades, so obsolescence management was rarely an issue when aircraft designs were agreed. However, it is now estimated that 60% of the integrated circuits currently on aerospace products will become obsolete in the next five years.
21st October 2016


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